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1 JUN 2026 | COMPANY BLOG
The intelligent chassis: The silent upgrade that's changing how cars move
Steering, braking and suspension are going electronic, and it’s about to change how cars move and feel
Read more

[H2] Our passion
At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as we continue to pioneer advances in integrated circuits. Each generation of innovation builds upon the last to make technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress.
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downloadDownload our "2025 Corporate Citizenship Report"
90%Percentage of shipped semiconductor products considered green that meet low-halogen industry requirements.
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[H1] The intelligent chassis: The silent upgrade that's changing how cars move

[H2] Steering, braking and suspension are going electronic, and it’s about to change how cars move and feel

1 JUN 2026
|
Technology and innovation

You’re cruising down a highway at 70mph when a pothole appears in the distance. Normally, this would rattle everyone in the cabin, but your car has already detected the obstacle. Before the front tires reach the edge, the suspension softens, the damping recalibrates, and the vehicle eases over the pothole, leaving you and your passengers undisturbed.
That graceful series of adjustments is the work of the intelligent chassis, a vehicle architecture in which sensors, processors and electronic actuators replace the mechanical components that have controlled cars for the past century.
What's an intelligent chassis?
Traditionally, the systems that govern how a car moves have been mechanical: hydraulic fluid, metal linkages, steel springs. An intelligent chassis replaces those mechanical connections with electrical ones. The driver still turns the wheel – but the wheel no longer turns the tires directly. Instead, sensors capture the steering direction, processors interpret the signals in real time, and actuators at each corner of the vehicle complete the action.
“We’re moving away from the mechanical system into what we call ‘x by wire’: steer by wire, brake by wire or throttle by wire,” said Mark Ng, director of automotive systems at TI. That transition is moving quickly. In 2024, x by wire systems were valued at US$25.88 billion; by 2030, their revenue is forecasted to be USD$57.99 billion.
“By wire really means that semiconductors are at the heart of the vehicle,” Mark said. “Automakers are using electrical stimulus and electrical intelligence to control chassis functionality.”
So why is the intelligent chassis gaining traction now?
Electric powertrains, software-defined platforms and technological advancements designed to achieve greater autonomy have all converged. An intelligent chassis is the missing link that ties those advances together. This technology brings steering, braking and suspension under direct software control.
“Most people think the future of the car is just about more: more screens, more software,” said Jerry Shi, general manager of powertrain and chassis at TI. “But one of the biggest changes is the one you don’t see but feel. Intelligent control is about how your car moves, stops and adapts.”
For automakers, this shift enables new design possibilities. Without a steering column running through the dashboard or hydraulic lines snaking through the floor, engineers can rethink cabin layouts and package batteries in electric vehicles more efficiently.
For drivers, the vehicle no longer requires constant vigilance. Instead, its sensors and processors interpret the road ahead and respond with precision. "The car can support its human driver with quick thinking and reactions," Jerry said. “Replacing mechanical connections with precise electronic control creates a smoother, safer and more predictable driving experience.”
Making the transition to x by wire a reality
Replacing a mechanical steering column with a wire is no small feat. When the mechanical backup goes away, every electronic component has to be safer, faster and more reliable than what came before.
Sensing must be extremely precise; the system must know the exact angle, torque and position of every movement and measure response times in microseconds, not milliseconds. Auto manufacturers must also prioritize redundancy for every device in the signal chain so that a single fault never cascades into a failure.
To meet the demands of intelligent chassis, manufacturers need an ecosystem of semiconductors working in tandem. “As the market matures, there will be a heavy level of integration,” Mark said. “It’s Moore’s law. People will expect devices that have a microcontroller and a driver and a communication interface and more – in a single chip.”
Semiconductor technologies are powering the next generation of safer, smarter and more responsive vehicles across four areas:
Precise sensing preserves the integrity of real-world signals, even in extreme temperatures and harsh electrical conditions, so that every control decision starts with trustworthy data.
High-performance microcontrollers with lock-step cores verify calculations to (for example) shrink braking distances and cut steering latency without compromising safety-critical processes.
Flexible gate drivers balance switching speeds against electromagnetic interference, giving steering a natural feel and braking a firm one.
International Organization for Standardization 26262-compliant devices, up to Automotive Safety Integrity Level D, equip system designers with the documentation and architecture to certify the full vehicle.

open-in-new
Read more about the semiconductor technologies that are fundamental to the intelligent chassis. Opens in a new tab

What’s next for the intelligent chassis?
Remember the scenario about a smooth drive over a pothole? What if your car could accomplish it on its own?
The intelligent chassis represents what’s next in the automotive industry, especially when it comes to autonomous vehicles.
“Before cars can drive themselves, they must learn how to move better,” Jerry said. “The intelligent chassis is a must-have transition step toward autonomous driving.”
With an intelligent chassis, the car of the future won’t just take you where you need to go. The trip itself will fundamentally change how you move: with less anxiety, less fatigue and more room to think, talk, work or simply enjoy the drive.

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[H1] TPS61290

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[H2] 5.5V, 11A, synchronous boost converter with bypass mode and I2C interface

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Data sheet

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TPS61290x 5.5V, 11A, Synchronous Boost Converter With Bypass Mode, I2 C Interface, and Fast Transient Response datasheet

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[H3] TPS61290

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Data sheet

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[H3] Product details

Rating

Catalog

Topology

Boost

Vin (max) (V)

5.5

Vin (min) (V)

2

Vout (max) (V)

5.5

Vout (min) (V)

2.35

Switch current limit (typ) (A)

11

Features

Adjustable current limit, Automatic PWM/PFM transition, Enable, I2C, Load Disconnect, Output discharge, Pass-through mode, Spread Spectrum, Synchronous rectification

EMI features

Spread Spectrum

Operating temperature range (°C)

to

Iq (typ) (A)

0.00002

Duty cycle (max) (%)

90

Rating

Catalog

Topology

Boost

Vin (max) (V)

5.5

Vin (min) (V)

2

Vout (max) (V)

5.5

Vout (min) (V)

2.35

Switch current limit (typ) (A)

11

Features

Adjustable current limit, Automatic PWM/PFM transition, Enable, I2C, Load Disconnect, Output discharge, Pass-through mode, Spread Spectrum, Synchronous rectification

EMI features

Spread Spectrum

Operating temperature range (°C)

to

Iq (typ) (A)

0.00002

Duty cycle (max) (%)

90

DSBGA (YBG)

16

2.486929 mm² 1.577 x 1.577

Wide VIN range from 1.8V to 5.5V
Start-up input voltage: 2.2V
Programmable average input current limit (3.5A to 11A) through I2C
Programmable output voltage (2.35V to 5.5V) through I2C.
For TPS61290, default 3.4V
For TPS612901, if VSEL = L, default 5V; if VSEL = H, default 5.25V
< 150mV undershoot at VIN = 2.7V, VOUT = 3.4V, IOUT = 0A → 3A (0.2A/µs slew rate)
Integrated bypass MOSFET (8mΩ), high-side MOSFET (8mΩ), low-side MOSFET (10mΩ)
Auto bypass mode when VIN > VOUT
Auto PFM operation or Forced PWM selectable at light load
Output discharge function when EN logic is low
True disconnection between input and output during shutdown
Thermal shutdown and over current protection
I2C compatible I/F up to 1Mbps
1.2V I/O logic control interface
16-ball WCSP package

Wide VIN range from 1.8V to 5.5V
Start-up input voltage: 2.2V
Programmable average input current limit (3.5A to 11A) through I2C
Programmable output voltage (2.35V to 5.5V) through I2C.
For TPS61290, default 3.4V
For TPS612901, if VSEL = L, default 5V; if VSEL = H, default 5.25V
< 150mV undershoot at VIN = 2.7V, VOUT = 3.4V, IOUT = 0A → 3A (0.2A/µs slew rate)
Integrated bypass MOSFET (8mΩ), high-side MOSFET (8mΩ), low-side MOSFET (10mΩ)
Auto bypass mode when VIN > VOUT
Auto PFM operation or Forced PWM selectable at light load
Output discharge function when EN logic is low
True disconnection between input and output during shutdown
Thermal shutdown and over current protection
I2C compatible I/F up to 1Mbps
1.2V I/O logic control interface
16-ball WCSP package

The TPS61290x provides a
power supply design for products powered by a nickel-rich, silicon anode, Li-ion, or
LiFePO4 battery. The voltage range is optimized for single-cell portable
applications like in smart-phones or POS terminal.Used as a high-power pre-regulator, the device
extends the battery run-time and overcomes input current and voltage limitations of
the powered system. With a wide input voltage range of 1.8V to 5.5V. Program the
output voltage by I2C up to 5.5V. The default output voltage of TPS61290
is 3.4V. The default output voltage of TPS612901 is 5V (VSEL = Low) and 5.25V (VSEL
= High).During operation, when the battery is in a good
state of charge, the TPS61290x works in bypass mode,
connecting the battery to the power supply system through the bypass FET. If the
battery gets to a lower state of charge and the voltage becomes lower than the
desired minimum system voltage, the device seamlessly transits into boost mode to
use the full battery capacity.The TPS61290x offers a very
small design size with a 16-ball YBG package.
The TPS61290x provides a
power supply design for products powered by a nickel-rich, silicon anode, Li-ion, or
LiFePO4 battery. The voltage range is optimized for single-cell portable
applications like in smart-phones or POS terminal.Used as a high-power pre-regulator, the device
extends the battery run-time and overcomes input current and voltage limitations of
the powered system. With a wide input voltage range of 1.8V to 5.5V. Program the
output voltage by I2C up to 5.5V. The default output voltage of TPS61290
is 3.4V. The default output voltage of TPS612901 is 5V (VSEL = Low) and 5.25V (VSEL
= High).During operation, when the battery is in a good
state of charge, the TPS61290x works in bypass mode,
connecting the battery to the power supply system through the bypass FET. If the
battery gets to a lower state of charge and the voltage becomes lower than the
desired minimum system voltage, the device seamlessly transits into boost mode to
use the full battery capacity.The TPS61290x offers a very
small design size with a 16-ball YBG package.

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Data sheet
TPS61290x 5.5V, 11A, Synchronous Boost Converter With Bypass Mode, I2 C Interface, and Fast Transient Response datasheet

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15 Jun 2026

EVM User's guide
TPS61290 Boost Converter With Bypass Mode Evaluation Module

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15 Jun 2026

[H3] Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

[H4]

TPS61290EVM

— TPS61290 evaluation module

The TPS61290EVM is designed to demonstrate the features and functionality of the TPS61290x device, which is a high-performance, high-efficiency, synchronous boost converter with bypass mode and I2C interface. The factory default settings of the TPS61290EVM allow the operation with an input voltage (...)

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TPS61290 PSpice Transient Model

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DSBGA (YBG)

16
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