Training Example: Teradyne – Review the Data, Give Your Score & Compare to the Real AI Evaluation

[H1] Powering the Pursuit of Innovation
We excel in innovative test solutions and advanced robotics From life-saving healthcare and automotive safety to the consumer tech we use every day – the world relies on Teradyne to make sure critical electronics work, every single time. Defense & Aerospace Memory Production Board Semiconductor Silicon Photonics Storage System Level Wireless We provide an AI-powered Robotics Platform, including individual work cells with cobots, moving between work cells or warehouses with AMRs, and hybrid mobile cobots for anything in between. Autonomous Mobile Robots Collaborative Robots Teradyne Companies
[H2] Together, We Solve Complex Test and Automation Challenges
Streamlining transportation and material handling Innovative cobot solutions for limitless automation Simplifying wireless testing for the lab, DVT and manufacturing Leading the way in scalable photonics testing Upcoming Events
[H2] Careers
[H3] Build your career with us
We are the test and automation experts behind the electronics you use every day. Our customers depend on us to get their product to market, fast. It’s an exciting business and we’re looking for talented people who share our passion and drive. Find Jobs
[H2] In the News
[H3] Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo Electron
Teradyne’s UltraFLEXplus platform paired with Tokyo Electron’s probing technology delivers known good device screening for advanced 2.5D/3D packages. Read the Press Release
[H2] Our Latest Blog
[H3] The AI Server Challenge: Testing Power at Scale
In our latest blog, explore how AI’s growth depends on reliable and efficient power delivery and on the ability to validate that power at production scale. Read the Blog

Home | Defense & Aerospace Support & Services
[H1] Sustainment & Life-cycle Support
[H2] Optimized Test Solutions, Maximum Uptime, Minimum Life Cycle Costs
Teradyne’s Total Support Solution spans the entire ATE life cycle from initial configuration and TPS development through deployment, sustainment, and technology updates. Managing long-term ATE effectiveness and sustainment involves more than just maintenance and repair. Total Support Solution combines Teradyne’s long-term product support, unmatched engineering expertise, and deep knowledge in defense logistics to provide support solutions specific to customer’s needs throughout the ATE life cycle, enabling customers from integration labs to factories and MRO shops to achieve optimized test solutions, maximum equipment uptime and minimum life-cycle costs.
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[H3] Teradyne Support and Service Offerings Encompass Every Aspect of the ATE System
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[H3] Product Support
Product Support Contracts are created based on customer’s needs. Standard Support Agreements include parts replacement/repair, preventative maintenance visits, on-site field service engineering, and hotline to Customer Care Center for technical assistance. Teradyne offers industry unique Parts Services to meet customer’s specific availability requirements. With inventory and repair centers located across the globe, we have the infrastructure to support nearly every kind of spare parts strategy. For U.S. D&A Parts Service, call 1-877-Teradyne (1-877-837-2396), Option 1 For U.S. D&A Technical Assistance, call 1-877-Teradyne (1-877-837-2396), Option 2
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[H3] System, Application, TPS Engineering Services
Teradyne offers a broad range of project-based solutions and engineering services from developing test strategy to customer training. With a successful history of developing test applications, interfaces, and TPS, our applications team has the proven experience and capability to accelerate customer’s success through all stages of test. For customers looking for complete test solutions, Teradyne offers the complete Total Test Solution which includes test equipment, TPS, documentation and long-term support.
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[H3] Sustainment and Life Cycle Support
Decades of experience in Defense and Aerospace testing has provided Teradyne with in-depth knowledge of defense logistics and extensive life cycle support capabilities to ensure our customers’ operational success. We provide reliability improvement, program and configuration management as well as obsolescence management and tech update solutions. Our service offerings are aligned to meet customers’ strategic objectives and represent a partnership between us and our customers. Teradyne’s service contracts control and reduce costs over time through commitment to quality improvement activities.
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eKnowledge Teradyne’s eKnowledge portal gives customers detailed technical information to support the operation and maintenance of their Teradyne test systems, instruments and software. With access to the self-service, web-based portal, you can download current software, find and read the latest release notes and user manuals and submit technical questions to our experienced team. Parts Repair Parts Repair is available through Teradyne’s Global Services Organization. Services can be accessed over the phone, on the web via our online portal or through our Customer Care Center for service issues requiring immediate assistance. Product Support Status Access information about Teradyne Defense and Aerospace products that are out of production and/or no longer supported. Training Teradyne offers a full suite of training classes, seminars and workshops, which are delivered at our corporate headquarters or at your site. Teradyne can also develop customized training seminars addressing topics inherent to your individual test environment. Register online for a class or view our schedule to see which classes are available.
[H3] Related Solutions & Services
Large Portfolio of Modular Test Instruments and SubsystemsDefense & Aerospace InstrumentationScalable Test Systems for a Wide Range of Test ChallengesDefense & Aerospace Configurable Test Systems

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[H1] UltraFLEX
[H2] Test System Optimized for High-Performance Digital and SoC
Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count. AdvantagesApplications & ConfigurationsSystem OptionsTest Cell Solutions Contact Teradyne
[H2] Advantages
Superior Flexibility, Throughput & Scalability The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel. Maximum Test Quality and Yield The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device. Faster Time to Production Teradyne’s IG-XL software speeds time to market and reduces cost of test by transforming test program development.
[H2] Applications
Mobile Application Processor Digital Baseband Processors High Data Rate RF Transceivers RF Connectivity Devices mmWave 5G Mobile Power Management ICs (PMIC) Microprocessors Network Processors High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers Storage Controllers High-end Microcontrollers Audio and Video Processors
[H2] Configurations
The two available UltraFLEX base systems allow customers to optimize capital cost and floor space, and maximize resource count. All three versions will accept the same device interface boards (DIBs) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot. The UltraFLEX test heads utilize SureMate® connections to the DIB which provide easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability. UltraFLEX-HD 12-slot system UltraFLEX-SC 24-slot system
[H2] System Options
The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses. Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options. The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers. The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability.  Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices. The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing.  The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times. The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX. The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability. The UltraSerial10G is a high-speed serial instrument that can test expanding serial bus technologies and replicates the device operating environment for optimal test quality at device limited test time with the highest possible throughput. This instrument has 20 differential drive and receive ports (40 channels/80 wires) per board, a frequency range of 42Mbps to 10.7Gbps with 426M drive/compare, and 1Gig capture memory, and includes pseudo-random bit stream (PRBS) hardware, and protocol aware testing support for PCIe. All of these features are designed to provide an efficient test methodology for SerDes bus testing.
[H4] Wireless Test
UltraWaveLX The UltraWaveLX subsystem, available in multiple configurations, delivers emerging wireless protocol capabilities by seamlessly integrating LitePoint’s leading edge technologies within the UltraFLEX platform. The UltraWaveLX-RF delivers 802.11be (Wi-Fi 7) testing capabilities, while the UltraWaveLX-UWB serves UWB testing conditions, and the UltraWaveLX-60G supports mmWave applications in the 60 GHz band. These configurations can be combined to deliver multiple cutting-edge RF test capabilities within a single test platform. UltraWave24 The UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available, and integrate waveform sourcing and capturing onboard to eliminate the need for additional tester instruments. The UltraFLEX ESA software toolkit and UltraDSP option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high-speed data bus for simple correlation to industry standards and the highest possible throughput. Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of testing demands. UltraWaveMX The UltraWaveMX53, UltraWaveMX44, UltraWaveMX20-D16 and UltraWaveMX8 are Teradyne’s MX family of instruments for mmWave frequencies. These instruments extend the UltraWave24 capability for full test coverage of WiFi, LTE, Ultra-wideband and 5G standards for frequencies below 52.6 GHz. Existing UltraWave24 customers can upgrade their systems with a single slot instrument that does not require reconfiguration of the test system. They can continue to use existing device interface boards (DIBs) and production interface docking compatibility for their existing applications. The MX family of instruments targets RF and IF interfaces for both 5G IF transceiver and 5G RF beamformer device coverage. And they support characterization and production device testing for probe, package, module and over-the-air applications. A patented active thermal control within the instrument guarantees temperature stability to ensure that high-performance specifications are met in the engineering and production environments. The UltraWaveMX instruments also feature integrated power detectors which provide specification traceability. There is a dedicated low phase noise DUT reference clock operating from 100 MHz to 6 GHz to supply a precision reference clock for devices with integrated PLLs. These instruments feature native 5G-NR modulation and demodulation test coverage with the integrated ESA toolkit using industry-standard waveform algorithms for waveform modulation and demodulation to simplify bench-to-ATE correlation. The instruments provide dedicated mmWave frequency blind-mate coaxial DIB connections, which are designed to withstand the challenges of a production environment while providing the performance to source and measure high quality from 8 GHz to 53 GHz test waveforms to the device. The award-winning IG-XL test software environment enables simple programming for fast test program development. Interactive debug displays integrated with the instrument hardware create an intuitive software system that minimizes training and speeds time to market. The UltraWaveMX53 addresses the need to cover the 5G FR2 frequencies up to 52.6 GHz. The instrument provides unmatched performance over the full frequency range with fully integrated temperature stabilization and calibration features. The integrated synthesizer per channel architecture provides best-in-class phase noise performance that enables source and measure capabilities of modulated waveforms with unprecedent EVM performance. The UltraWaveMX53 instrument is available in three configurations: -D16, -IF and -RF. Each of these configurations provide two channels and 16 ports that cover up to 53 GHz. The IF and RF configurations add two more channels with a total of 16 additional ports that cover up to 20 GHz and 44 GHz respectively. Teradyne’s UltraWaveMX44 provides coverage from 24 GHz to 44 GHz.  The available 32 mmWave ports on the UltraWaveMX44 significantly simplify DIB design. For greater site density, the system can scale to up to 128 mmWave ports, which is necessary for multisite testing that delivers the lowest cost of test. The UltraWaveMX20-D16 is Teradyne’s lower frequency band instrument. It is also an extension to the UltraWave24 to provide additional test coverage up to 20 GHz. This frequency band targets devices that have WiFi-6, Cellular 5G, Ultra-wideband, and 5G-NR IF interfaces. Each UltraWaveMX20-D16 provides 16 mmWave ports in the test system with the ability to scale to 64 mmWave ports for high site count testing. The UltraWaveMX8 adds mid-band RF test capabilities to support WiFi-6E & 5G test needs. Adding the MX8 as a 1-slot upgrade to any UltraFLEX system with UltraWave24 extends the frequency range to 7.5GHz. Up to 160 MHz of bandwidth is available for supporting 802.11 modulated tests, and 16 RF ports with 8 channels are provided for high parallelism and efficiency. The MX8 provides industry-leading WiFi-6E test capabilities with faster time to market, higher yields, and lower costs. By utilizing Teradyne’s UltraWave instruments, semiconductor manufacturers can configure their test systems with the most cost-effective solution to test current and future generations of mmWave devices, enables faster time to market and higher product yields. The MX44, MX20, and MX8 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility. As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services. Learn More About Teradyne's Test Cell Solutions

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[H1] Titan
[H2] Asynchronous System Level Test Platform
The Teradyne Titan™ System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements. AdvantagesBaseline ConfigurationChange Over Kit Contact Teradyne Semiconductor components continue to grow in complexity as process nodes shrink. IC designers are now designing complete System-on-Chip (SoC) products that contain core processors, analog I/O, digital I/O, modem and/or other IP blocks along with embedded software. Utilizing System Level Test as a third test process step, following wafer and package test, enables the semiconductor manufacturer to test software and hardware together to validate connections between IP blocks in a manner that isn’t otherwise practical. Titan provides the additional test coverage needed to meet stringent end customer failure rate requirements for improved product quality.
[H2] Production Proven Solution
Titan’s asynchronous slot architecture offers unmatched operational efficiency. It optimizes utilization and provides a 30% throughput advantage over traditional batch systems, thereby lowering the cost of test across a large mix of products. The asynchronous slot architecture also provides the unique ability to test two different products at the same time on the system, while the internal robotics vision system ensures high placement accuracy of the semiconductor device into the test fixture. The test fixture integrates into the system with a high signal integrity interface using ATE style interconnects, providing up to 20Gbps data rates with reliability exceeding over 100k test insertions. The asynchronous testing capability also enables maintenance to be performed without stopping system operation. The modularity of the Titan system provides production proven flexibility to test various device package types including PoP, BGA, PGA and LGA. Its flexibility enables customers to integrate existing hardware into the functional rack, slot and/or carrier. This reuse of hardware and software allows for test program commonality, faster deployment of programs and efficient program support. When product change-over is required, an automated process minimizes the time needed to execute changing the product to be tested. Titan is offered as either a 320 or 424-site system with the same small footprint, enabling a high number of devices to be tested per square meter of factory floor space. A smaller 20-site Titan development station is also available for DUT board design verification testing, developing and validating test programs, troubleshooting DUT board HW issues, DUT board test and repair activities, and enabling SLT in non-production environments.  This development station allows R&D, QA and Production to use the same DUT test board, enabling a faster ramp to production with a common engineering and production platform. Want to learn more? Download the System Level Test white paper.
[H2] Baseline Configuration
[H3] System Mainframe
Up to 424 test sites per system Slots are fully asynchronous for both loading and testing 15°C air cooling for up to 50W of heat dissipation Up to 15 fail bins available Test sites can be serviced while the system continues operating
[H3] Asynchronous Test Slots
1Gbps Ethernet port per test computer 1 Serial port per DUT 1 JTAG enabled port to each DUT 1 SPI interface to each Test Board VTESTBOARD Power Supply: 24V Sustained DUT + Test Board Power: 38W max per site Power control/measurement
[H2] Change Over Kit
Titan’s architecture enables device transition flexibility with low changeover time and reduced cost Minimal Teradyne or customer-developed components are required for each device type change: Socket lids (Teradyne) DUT shuttles (Teradyne) Updated device specific vision job (Teradyne) Test board and socket (Customer or Teradyne)